Thickness Control Technology for CMP Process
نویسندگان
چکیده
منابع مشابه
Copper CMP and Process Control
A production worthy, copper CMP technology has been successfully developed on a multi-platen CMP system. The System consists of three polish platens, each of which is equipped with an optical endpoint detection system. The process consists of three steps with different polish slurries, and is designed to polish copper with a tantalum based barrier, and to achieve good defect performance. Patter...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2018
ISSN: 0912-0289,1882-675X
DOI: 10.2493/jjspe.84.239